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J. Appl. Phys. 101, 023504 (2007) [pdf] | ||
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Reduction of the Residual Compressive Stress of ta-C Film by Ar Background Gas during the Filtered Vacuum Arc Process |
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Tae-Young
Kim, Churl Seung Lee, Young Jin Lee, Keun-Hwa Chae, Kwang-Ryeol
Lee, Kyu-Hwan Oh |
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Tetrahedral amorphous carbon (ta-C) film was prepared by the filtered vacuum arc (FVA) process with Ar background gas. The residual compressive stress of the film decreased significantly as the Ar flow rate increased, whereas negligible change in the mechanical properties was observed. Structure analysis by Raman spectroscopy, near edge X-ray absorption fine structure (NEXAFS) and electron spin resonance (ESR) spectra revealed a close relationship between the residual compressive stress and the bond distortion that invokes paramagnetic defects or unpaired p electrons. These results demonstrate that the stress reduction can occur by relaxation of the distorted or twisted atomic bonds at the same fraction of sp3 hybridized bonds, which enhances the stability of the ta-C coating without deterioration in the advantageous properties. The effect of Ar background gas is discussed in terms of the increased ion population of low kinetic energy in the plasma beam. | ||
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