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Acta Mater. 52, 3151-3159 (2004). [pdf] | ||
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Buckle Delamination on Patterned Substrates
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Myoung-Woon Moon, Kwang-Ryeol
Lee, Kyu-Hwan Oh and John. W. Hutchinson |
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Lithographic techniques applied to a substrate prior to film deposition can create areas of low interface adhesion surrounded by regions of high adhesion. If the film is under compression and if buckle delamination is nucleated, conditions can be controlled such that delaminations are confined to the patterned areas of low adhesion. When the area of low adhesion is a strip, the width of the strip controls the buckle morphology: smooth Euler buckles for narrow strips, telephone cord buckles for wider strips, and symmetric varicose buckles under a very limited range of conditions. Tapered strips provide an accurate means of measuring interface adhesion toughness based on the width of the trip where the delamination arrests. | ||
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