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MRS2003,
Fall Meeting, Boston, USA [PDF] |
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The Thermal Annealing Effect on the Residual Stress
and Interface Adhesion in the Compressive Stressed DLC Film
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Heon Woong Choi, Myoung-Woon
Moon, Tae-Young Kim, Kwang-Ryeol Lee and Kyu Hwang Oh
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We
studied on the thermal annealing effect on the residual stress and
the mechanical properties in thin compressive stressed diamond-like
carbon film on Si substrate. Annealing experiments were carried
out with Rapid Thermal Procedure system at 200-600 °C, and the
stress change with annealing temperature was investigated by in-situ
stress measurement system. The apparent stress reduction occurred
with minimal structure changes. In order to measure the change of
chemical structure of diamond-like carbon film by annealing, we
used Raman spectrometer. The adhesion deterioration in interface
has been detected as annealing temperature increased. In the compressive
stressed DLC film, we observed the dramatic evolution of interface
delamination at certain high temperature using in-situ heating stage
built in Environment SEM. The quantitative change of adhesion affected
by annealing process was also measured with scratch testing. For
exploring the interface structure affected by the thermal annealing
process at high temperature, the cross section of annealed film
has been observed with HR TEM. |
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