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Mater. Sci. Forum, 475-479, 3619-3622 (2005). [pdf] | ||
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The Thermal Annealing Effect on the Residual Stress and Mechanical Property in the Compressive Stressed DLC Film |
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H. W. Choi, M.-W. Moon, T.-Y.
Kim, K.-R. Lee and K. H. Oh |
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DThe thermal annealing effect on th compressive residual stress has been presented in thin diamond-like carbon (DLC) film on Si substrate. Annealing experiments were carried out with Rapid Thermal Procedure system at from 200 to 600oC, and the variation of residual stress with annealing temperature was investigated by in-situ stress measuring system. The stress reduction occurs as annealing temperature increases, while the change of chemical structure of DLC film is not significantly changed with obwervation by Raman spectrometer. The elastic modulus and hardness are not deteriorated when annealing temperature is controlled at less than 400 degree of Celsius, where the residual stress is apparently reduced. | ||
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